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Today's Brief/Sunday, 26 July 2026/๐Ÿš€ Business & Startups
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Samsung Lands $200 Billion Broadcom AI Chip Deal Through 2030

mint - companiesยทSunday, 26 July 2026
Samsung Lands $200 Billion Broadcom AI Chip Deal Through 2030

Samsung Electronics has struck a partnership with US chip designer Broadcom covering memory chips, contract chip manufacturing, and advanced packaging, with the total value envisaged to exceed $200 billion until 2030. The deal is a significant boost for Samsung's foundry business as it competes with rivals like TSMC.

Why It Matters

This deal shapes who controls the hardware that runs the world's AI systems โ€” and the pricing and availability of chips affects everything from your smartphone to cloud services.

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